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Intel developing new chip designs in India

Bangalore, Oct 11 (IANS) Intel Corporation, the $39-billion largest chip maker in the world, is developing new chip designs and processors at its India development centre to roll out the next generation of notebooks and servers, says a top company official.

Wednesday, October 11, 2006 | 12:17:48 PM IST (+05:30 GMT)
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Bangalore, Oct 11 (IANS) Intel Corporation, the $39-billion largest chip maker in the world, is developing new chip designs and processors at its India development centre to roll out the next generation of notebooks and servers, says a top company official.

'The Intel India Development Centre (IIDC) in Bangalore is working on new chipsets for the small form-factor notebook, code-named Napa SFF, the next generation mobile platform, code-named Santa Rosa, and the low-cost notebook Classmate PC.

'Validation work on server processors 5300 and 7100 are also being undertaken at the IIDC, which is our second largest R&D facility outside the US,' Intel digital enterprise group senior vice-president Pat Gelsinger said at the 10th Intel Developers Forum (IDF) here Tuesday.

With about 3,000 techies, Intel India was earlier involved in the development of Napa SFF platform that constitutes the core of the small form notebook. Napa SFF includes key components, including the designed-in-India chipset that enhances performance, battery life and ease of communication.

'This innovation provides about 50 percent smaller form factor and an extended battery life lasting 12 hours. The new systems deliver breakthrough capabilities to make entertainment truly mobile for people on the move, improve responsiveness and efficiency of mobile workers. These systems have been designed for global market needs and are prominently deployed in Japan,' Gelsinger said.

The small size of the platform components of Centrino Duo mobile technology enables the manufacture of a variety of laptop sizes in innovative designs with more energy.

Intel officials declared the Classmate PC, targeted at the student segment, will be launched in the market later this year through 10 original equipment manufacturers (OEMs), with whom the company has formed alliances for the product.

'The WiMax (worldwide interoperability for microwave access) chip is scheduled for a global launch later this month to support mobile networks. We are already in talks with governments and mobile operators to roll out WiMax services in the sub-continent too,' Intel mobility group vice-president Mooly Eden told developers at the IDF.

Intel also plans to introduce its first mobile WiMax compliant product (Connection 2250) in the Indian market over the next six months. The new system-on-chip connects the fixed line with mobile WiMax, enabling OEMs to build CPEs at attractive price points and service providers to upgrade their networks

Though WiMax is not a technology per se, the term is used to certify the high-tech equipment that meets the IEEE 802.16 standard, set by WiMax Forum for conformity and interoperability. It is a notch above Wi-Fi (wireless fidelity), whose equipment is based on 802.11 standard and used for wireless local area networks (WLAN).

'Earlier, customers used to sacrifice one or more capabilities to have a mobile PC. In the last couple of years, Intel has taken mobile computing to new levels of performance, connectivity and battery life to provide mobility without compromising on the benefits of desktop computing,' Eden pointed out.

Intel's next generation 45nm (nano metre) technology is also on track for production in the second half of 2007 as planned.

'We have 15 45nm products in the development process across desktop, mobile and enterprise segments. The first of these products is on track to complete it

Copyright : Indo-Asian News Service
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